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BE Semiconductor Industries N.V. BE Semiconductor Industries N.V. (“Besi” or the “Company”) is a leading manufacturer of semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly applications. Our technologically advanced equipment and integrated systems are used principally to produce semiconductor assemblies or “packages”, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. Our innovative systems offer customers high productivity and improved yields of defect-free devices at a low total cost of ownership. |
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